RF and DC Dual Chamber Magnetron Sputtering System

RF and DC Dual Chamber Magnetron Sputtering System

RF and DC magnetron sputtering system deposits source (target) material on a substrate by ejecting   neutral atoms from the target through plasma bombardment. The plasma is created through ionization of an inert gas by applying DC or RF field at low pressure and magnetron is used to focus the plasma to the target for efficient deposition. 

 

 

 

Equipment Details

 

Key Features

 

Application Areas

 

 Model: RMS 2000L series

 Manufacturer:Rocky Mountain   Vacuum Tech, USA

 Target size: 3"

 RF power: 600W

 DC power:1000W

 Vacuum: 10-9 mbar

 

  • Semi automated vacuum process

      control ceramics and metal 

      coating system

  • Dual chambers connected with a

      load lock chamber for inter 

      chamber transportation of the 

      sample

  • Insitu substrate heating upto

      800oC

  • Differentially variable speed

      rotating substrate carrier for 

      uniform coating

 

  • Materials science
  • Microelectronics

 


Last updated on : 15-06-2018 10:17:02am