Sputtering is a versatile physical vapor deposition process to fabricate a variety of metallic, oxide, nitride and carbide coatings. At SED, different types of sputtering systems such as planar magnetron, balanced and unbalanced magnetron sputtering of different cathode dimensions have been indigenously developed. The sputtering is carried out using DC, pulsed DC, RF and HIPIMS power supplies.
A semi-industrial scale sputtering system has been designed by NAL to deposit PVD coatings on sample sizes as large as 6″x6″x6″.
Last updated on : 11-05-2018 03:06:13pm