Interface reaction between electroless Ni–Sn–P metallization and lead-free...

Interface reaction between electroless Ni–Sn–P metallization and lead-free...

Interface reaction between electroless Ni–Sn–P metallization and lead-free Sn–3.5Ag solder with suppressed Ni3P formation, Ying Yang, J.N. Balaraju, Yizhong Huang, Yee Yan Tay, Yiqiang Shen, Zviad Tsakadze, Zhong Chen, Journal of Electronic Materials, 43 (2014) 4103-4110, doi: 10.1007/s11664-014-3306-z 


Last updated on : 08-01-2018 04:04:21pm