Ceramic substrates are used for a wide range of applications in electronics including thin and thick film microelectronics, high power and high frequency circuit, RF/microwave components and capacitors or resistors. For such applications, the ceramic substrates should possess good mechanical strength and abrasion resistance, high thermal conductivity, excellent electrical insulation and stability in high temperature and corrosive chemical environments. Alumina (Al2O3) and aluminum nitride (AlN) are well known electro-ceramics which are being used as substrates for electronic packages, heat sinks, IC packages, microwave device packages, etc. due to their unique properties. Globally it is predicted that the sales of space electronic substrates will reach USD184 million by 2017 and, in particular Chip Scale Package (CSP)-LED ceramic substrates market is expected to be USD 700 million by 2019. To date, these substrates are being mostly imported in the country and the main method used for the manufacture of ceramic substrates with precisely controlled thickness and consistency is the tape casting technique.
SED in partnership with M/s. Carborundum Universal Ltd. (CUMI) has developed 100 and 250 µm thick Al2O3 and YSZ tapes and is now in the process of transferring the technology to CUMI (TRL-6). The properties of the developed Al2O3 and YSZ substrates are at par with the imported substrates. SED team has also developed expertise in the fabrication of free standing ceramic substrates with various thicknesses using both aqueous and non-aqueous based slurries and is currently developing AlN substrates for VSSC.
Last updated on : 18-12-2017 09:53:03am