Plasma enhanced chemical vapor deposition (PECVD)

Plasma enhanced chemical vapor deposition (PECVD)

It is a chemical vapor deposition process which uses plasma for thin film deposition. Thin films and coatings can be deposited from respective precursor chemical vapors using RF plasma. This technique has been used to deposit Diamond Like Carbon (DLC) and metal doped DLC coatings over stainless steel and Ti alloys for enhancing tribological properties.

 


 

Specification

Base pressure: 5.0 × 10-6 mbar

Antenna: Inductive coupling

RF generator Power: Maximum 600 W


Last updated on : 20-06-2018 01:36:34pm