Interface reaction between an electroless Ni–Co–P metallizationand Sn–3.5Ag...

Interface reaction between an electroless Ni–Co–P metallizationand Sn–3.5Ag...

Interface reaction between an electroless Ni–Co–P metallizationand Sn–3.5Ag lead-free solder with improved joint reliability, Ying Yang, J. N. Balaraju, Yizhong Huang, Hai Liu, Zhong Chen, Acta Materialia, 71 (2014) 69-79, doi: 10.1016/j.actamat.2014.02.026 


Last updated on : 08-01-2018 03:06:39pm